IC Assembly Services
Plastic Packages (Fully Encapsulated)
I2A Technologies (formerly IPAC)
Plastic Packages (Open Cavity)
Agile Enterprises Inc (formerly Mulvin & Company)
Flip Chip Bumping
In addition to the vendors below, flip chip bumping is also available for IBM and TSMC processes via the foundry. Contact MOSIS Support System.
Die and wafer carriers
Please note MOSIS does not necessarily endorse the products and services listed on this page.