Products > Fab Processes > IBM > IBM SIGe & CMOS Processes
5HP/5AM SiGe BiCMOS Process
IBM Semiconductor 0.50 Micron
Information vital to preparing and submitting a design for fabrication in this process has been posted to the MOSIS Secure Document Server.
All users must read the checking procedures and density requirements described in this document.
If your design will be used for production, i.e. non-MPW, please read the IBM policy described in "Checking and Error Disposition Strategy for IBM Designs."
Process Family DescriptionMOSIS is offering access to the IBM 0.50 micron SiGe BiCMOS 5HP technology for prototype and low volume fabrication. C4 (IBM's flip chip bumping) is subject to availability at additional cost. Advance notice required. Please submit your inquiry through the MOSIS Support System
This SiGe BiCMOS process has 3 metal (M1+M2+LM) and 1 poly layers, supports MiM (Q2 to M2).
5HP Supported Options
Please refer to the List of 5HP Supported Options page for the options available on MOSIS MPW runs in this technology. You may not submit a design containing any options or metals stack which are not listed here without prior arrangement with MOSIS.
While the process is capable of up to 5 metal layers, we offer 3. Other configurations are available for dedicated runs.
This SiGe BiCMOS process has 4 (M1+M2+MT+AM) metal and 1 poly layers, supports MiM (Q2 to M2, nitride only).
5AM Supported Options
Please refer to the List of 5AM Supported Options page for the options available on MOSIS MPW runs in this technology. You may not submit a design containing any options or metals stack which are not listed here without prior arrangement with MOSIS. While the process is capable of up to 5 metal layers, we offer 4 on multi-project wafer runs.
5HP and 5AM Design Considerations
To ensure that submitted data is on a 25 nm grid, please stream-out at 1 DBU = 25 nm (Cadence 0.025, not 0.001).
MOSIS does not fill for IBM processes. Designs for IBM runs must meet the IBM fill requirements when submitted.
The CAD tool support files, DRC and LVS decks, simulation files, cell libraries, and files listed on the IBM SiGe Design Kits page are the only kits and files available.
Design rules supported by this technology
Only the IBM design rules will be supported for this technology.
MOSIS Technology Codes MOSIS Technology Codes
The technology code for the 5HP process is IBM_5HP.
The technology code for the 5AM process is IBM_5AM.
Parametric Test Results and SPICE Model ParametersSee Test Results for IBM 0.50 micron runs
Reticle/Wafer Size, Steps, Die and Wafer Thickness
IBM SiGe BiCMOS
5HP/5AM Family Process
|Reticle Size (milli- meters, approx.)||Reticle Copies Stepped on Wafer (approx.)||
(+/- .5 mil)
Bumped Die Thickness *
(+/- .5 mil)
|Mils||Micro- meters||Mils||Micro- meters||Mils||Micro- meters|
|8||18 x 20||60||10||250||10||250||30||760|
* Die thickness only. Does not include height of the bumps.
To order a special bumped die thickness, describe your requirements in the SPECIAL-HANDLING parameter of your New Project, Fabrication, or Update Request.