Products > Fab Processes > IBM > IBM 0.13 Micron 8RF-LM Process
IBM 8RF-LM CMOS Process
Information vital to preparing and submitting a design for fabrication
in this process has been posted to the
MOSIS Secure Document Server.
All users must read the checking procedures and density requirements described in this document.
If your design will be used for production, i.e. non-MPW, please read the IBM policy described in "Checking and Error Disposition Strategy for IBM Designs."
MOSIS is offering access to the IBM 0.13 micron CMOS 8RF-LM technology for prototype and low volume fabrication. C4 (IBM's flip chip bumping) is subject to availability at additional cost. Advance notice required. Please submit your inquiry to the MOSIS Support System
Supported metal Stack:
M1, M2, M3, M4, M5, M6, MQ, LM
This CMOS process offers up to 8 metal layers. MOSIS is supporting 8 metal layers, 2-thick (M1, M2, M3, M4, M5, M6, MQ, LM) plus TD (transfer) to DV (glass cut). Supply voltages are 1.2 V core and 3.3 V I/O.
Please refer to the List of 8RF-LM Supported Options page for the options available on MOSIS MPW runs in this technology. You may not submit a design containing any options or metals stack which are not listed here without prior arrangement with MOSIS. Other configurations are available for dedicated runs, including 8SFG.
To ensure that submitted data is on a 10 nm grid, please stream-out at 1 DBU = 10 nm (Cadence 0.010, not 0.001).
8SFG Artisan libraries using High-Vt devices are not compatible with 8RF-LM.
MOSIS does not fill for IBM processes. Designs for IBM runs must meet the IBM fill requirements when submitted.
IBM has sub-licensed MOSIS to distribute this information to customers who have signed both the MOSIS customer agreement and the IBM Design Kit License Agreement.
The CAD tool support files, DRC and LVS decks, simulation files, cell libraries, and files listed on the IBM CMOS Design Kits page are the only kits and files available.
Design rules supported by this technology
Only the IBM design rules will be supported for this technology.
The technology code for the 8RF-LM process is IBM_8RF.
Parametric Test Results and SPICE Model ParametersSee Test Results for 0.13 micron runs
Reticle/Wafer Size, Steps, Die and Wafer Thickness
8RF-DM Family Process
|Reticle Size (millimeters, approx.)||
Reticle Copies Stepped
on Wafer (approx.)
|Die Thickness (+/- .5 mil)||
Bumped Die Thickness *
(+/- .5 mil)
|8||18 x 20||60||10||250||10||250||30||760|
* Die thickness only. Does not include height of the bumps.
To order a special bumped die thickness, describe your requirements in the SPECIAL-HANDLING parameter of your New Project, Fabrication, or Update Request.