Products > Fab Processes > IBM > IBM SIGe & CMOS Processes
IBM SiGe & CMOS Processes
Available for MPW and Dedicated Runs
MOSIS has compiled the following chart comparing various features to help you better select which IBM process is most appropriate to your application.
In addition to these processes MOSIS also offers IBM processes in the following runs. These processes support ITAR Regulated designs.
IBM SiGe BiCMOS Processes
|Feature Size||Process Name||CMOS Vdd [V]||SiGeFt[GHz] | BVceo(1)||Description|
|High Performace||High Breakdown|
|0.13ɥm||8HP||1.2, 2.5||200 | 1.77||57 | 3.55||5th generation SiGe technology for advanced RADAR and mmWave applications.|
|0.18ɥm||7WL||1.8, 2.5, 3.3||60 | 3.3||29 | 6.0||Reduced performance, yet most cost effective SiGe technology offered.|
|3.3, 5.0||35 | 5.5||25 | 7.5||Intended for power amplifier applications. 1KW5PAE introduces a 1Kohm-cm substrate.|
A process comparison including Ft and Fmax can be found at the IBM BiCMOS Key Technology Specifications page.
(1) BVceo is not a voltage limit for biasing unless the NPN is operating under a forced Ib condition. Vce greater than BVceo is allowed for other bias configurations, lower base impedance leading to higher voltage limits.
IBM CMOS, IBM SOI, and IBM RF CMOS Processes
|Feature Size||Process Name||Voltage (V) Core | I/O||Description|
|130 nm||8RF-DM||1.2 | 3.3||Use for low-cost, high performance wireless applications as Bluetooth, WLAN, cellular handsets and GPS.|
1.8 | 3.3
1.8 | 5.0
|Ideally suited for RF and wireless applications, as Bluetooth, LANs, cellular phones and RF identification tags.|
|7HV||1.8/5/20/50 |||Ideal solution for power management products, display drivers, printer and MEMS driver ICs.|
|7RF SOI||1.5 | 2.5||Optimized for RF switch applications, integrate multiple analog functions into single-chip solutions for mobile devices.|
You can request the IBM design kit (design rules, models, and Cadence and Agilent ADS design kits) by following the instructions on the MOSIS web site at IBM Design Rules, Process Specifications, and SPICE Parameters page.
ADS support for IBM is RFDE/Dynamic-Link, and can only be used together with the IBM Cadence design environment.
Design interface (design kit, services) are available for these processes.